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 1 SPEC No. 1 E L 0 6 8 1 0 7 ISSUE: Aug. 31. 1994 To;
1
SPECIFICATIONS
Product Type 80 0ut put L CD S e gm en t Driver
lode1
No.
LH1514AF
%This tentative specifications contains `20 pages including the cover and appendix. If you have any objections.please contact us before issuing purchasing order.
CUSTONERSACCEPTANCE DATE: BY: PRESENTED BY: Y. $tNO Dept. Genera .l Manager
REVIEWED BY:
PREPARED BY:
Engineering
Dept. 1
SHARP CORPORATION
SHARI=
LH1514AF
1
Contents Page 1.
Summary
................................................. ................................................
...........................................
2 2 3
2. Features 3. Block
Diagram
4. Functional 5. Pin 6. Pin
Operations
of Each Block
..................o..
3
5 5 7
Configuration Descriptions
....................................... ........................................
7. Description
8. precaution
of Functional
Operations
....................
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Maximum Ratings ,............................... Conditions
. . . . . . . . . . . . . . . ..*....... 13 13 13
9. Absolute
10. Recommended
11. Electrical
Operating Characteristics
. . . . . . . . . . . . . . . ..*............
12. Example 13. Example 14. Package
of System of Typical and Packing
Configuration Characteristic Specification
. . . . . . . . . . . . . . . . . . . . . . . . . 16 ....................... *~~=~~~~==....*~=~=~=~~ 17 18
(Note] This document contains confidential information such as copyright and know-how belonging to Sharp Corporation. The information herein shall therefore be used exclusively for the design of systems utilizing this product and may not be used for any other purpose. This document shall not be reprinted or disclosed to any third party without the prior written consent of Sharp Corporation. This product is designed to be used in electrical products such as office equipment , audio-visual equipment and other consumer products. You are requested to contact Sharp Corporation if you intend to use this product for specific applitrains or aircraft which have critical control or cations such as automobiles, safety requirements, antidisaster. anticrime systems or any other applications which require extremely high reliability. This product shall .not be used in any medical equipment which affects human life.
LH1514AF
2
1. Summary The LH1514AF is a 80 output segment driver LSI suitable for driving black and white dot matrix LC panels. Through the use of SST (Super Slim TCP) technology, it is ideal for substantially decreasing the size of the frame section of the LC module. The LH1514AF is particularly well suited to driving black and white LC panels used for palmtop personal computers because of its low-voltage operation (Supply voltage for logic system : -5.5 to -2.5 V). When combined with the LH1513A Common Driver, a low power consuming, high-precision LC panel display can be assembled.
2. Features
. Supply
Supply
voltage voltage
for for
the logic LC drive
system
Number of LC drive outputs Low output impedance (Typ.) Shift Clock frequency (Max.) Low power consumption Adopts a data bus system 4-bit/B-bit parallel input modes are selectable with a mode (MD) pin Automatic transfer function of an enable signal Automatic counting function which, in the chip select mode, causes the internal clock to be stopped by automatically counting 80 of input data . Line latch circuit reset function when DISPOFF active . Supports high capacity LC panel display when combined with the LH1513A Common Driver CMOS process (N-type Silicon Substrate) Package : 109 pin TCP (Tape Carrier Package) Not designed or rated as radiation hardened
: -5.5 to : -28.0 to (absolute : 80 : 1.5 kR : 6.5 MHz
-2.5 V -10.0 v maximum
rating
-30.0
V)
SHARP
LH1514AF
3
3. Block
Diagram
VOR FB DISPOFF EIO, EIOz LP XCK SHL MD
VZR VSR VSR YI
y2 . .._......._.._.----.--.--.--
Y79
Ye0
VSL V3L
V2L
VOL
4. Functional
Operations
of Each Block
Following a LP signal input, and after the chip select signal is input, a select signal is generated internally until 80 bits of data have been read in. Once data input has been completed, a select signal for cascade
the
selection
signal
shifts
Line
Latch
driver output pin is controlled by the control logic latch control, 80 bits of data are read in five sets All 80 bits which have been read into the data latch simultaneously latched on the falling edge of the LP output to the level shifter block.
and the data of 16 bits. are signal, and
SHARP
LH1514AF 4
V,)
based on the
FR and DISPOFF
selection signal output from the active control block. Once the selection signal has been output, operation of the data latch and data transmission are controlled, 80 bits of data are
.
.
SHARI=
LH1514AF
5
5. Pin
Configuration
6. Pin 6-l. Pin
Descriptions Designations
a9
90
91
92 93 94 95 96 to 103
TEST2 TEST1 SHL DISPOFF FR LP XCK DIO-D17
I I I I I I I I
Test mode selection input Test mode selection input Display data shift direction selection Control input for deselect output level AC-converting signal input for LC drive Display data latch pulse input Display data shift clock input Display data input
waveform
SHARP
LH1514AF
6
6-2.
Input/Output
Circuits
Input
Signal
Fig.1
Input
Circuit
[Applicable pins] DI,,-, ,XCK.LP.FR SHL,MD.DISPOFF
Input
Signal
Output
Signal
Control
Signal [Applicable EIO, .EI02 pins]
Fig.2
Input/Output
Circuit
+Control
Signal 11j
7
\
0
I-Control
t-
Signal
Control
-I Signal
3
v3
I
v5
Control Signal
V5
Fig.3
[Applicable LC Drive Output Circuit
Y1-Ye0
pins]
SHARP
LH1514AF
7
7. Description 7-l. Pin
of Functional
Operations
Functions
river vo the bias voltage used is set by a resistor divider. *Ensure that voltages are set such that VssLV0>V2>V,>V5. *To further reduce the difference between the output waveforms of LC driver output pins Y1 and Ys,,. externally connect VIR and VIL
*In
4-bit
parallel
input
mode,
input
data
into
the
4 pins
DI,,-D13.
ially
from YsO to Y1.
*The input signal is level-shifted from logic voltage level drive voltage level,and controls LC drive circuit. *When set to Voo level `L".the LC drive output pins (Y,-Yso)
to LC are set
*While set to `L".the contents of the line latch are reset.but read the display data in the data latch regardless of condition of DISPOFF. When the DISPOFF function is canceled.the driver outputs deselect level (V, or V,),then outputs the contents of the date latch on the next falling edge of the LP. That time.if DISPOFF removal time can not kee
*The input signal is level-shifted from logic voltage level to LC drive voltage level,and controls LC drive circuit. l Normally,inputs a frame inversion signal. *The LC driver output pin's output voltage level can be set using the line latch output signal and the FR signal.Table of truth value
SHARP
LH1514AF
8
*When set *When set
parallel to Voo level "L", 4-bit parallel to VSS level "H". 8-bit ip between the display data
input mode is set. input mode is set. and driver output pins
is
is set for input. *When SHL input is at VSS level "H", EIO, is set for input, and EIOs is set for output. 80 bits of *During output, set to "H" while LP*XCK is "H" and after data have been read set to `L" for one cycle (from falling edge to falling edge of the XCK),after which it return to "H". after the LP signal is input, the chip is selected *During input, After 80-bits of data have been read, the
(VII.
VT. Va. or V,)
is selected
and outnut.
7-2. 7-2-l.
Functional Truth
Operations Table
Here, [Note]
VSSlV,>V,>V3>Vs, L: VDo(-5.5 "Don't care" should be fixed There are two kinds of power for LCD driver, please supply specification for each power
to -2.5 V). H: VSS(O V), x: Don't care to "H" or "L", avoiding floating. supply (logic level voltage,LC drive voltage) regular voltage which assigned by pin.
SHARI=
7-2-2. Relationship Parallel between Mode
LH1514AF
9
the Display
Data
and Driver
Output
pins
(a) q-Bit
MD
Iclocd
:::
(b) a-Bit Parallel Mode
I y6 y
2
SHARP
LH1514AF
7-2-3.
Connection
Examples
of Plural
Segment
Drivers
(a) Case of SHL="L"
top data .,:li (data taking flow) Yso -Y,
last
data :,i;: i
EIO,
XCK LP . MD FR DIo-DIT
(b) Case of SHL=`H"
DIo-DI, FR MD LP . XCK
VDD
EIO,
Yl
EIOz
> EIO, Yl `Yso
EIOz --........-.+EIO, YI ------+y*o
EIOz 1
i[i (data top data
:A
`Ye0
taking
flow) last
;rT.,, I data
i
SHARP
LH1514AF
11
7-2-4.
Timing
\I
Chart
of 4-Device
cascade
Connection
FR
K l-l
LP
n
.
DIo-DI, .I/ device EI (device A I. device B I/ I. I/ device C device D
A)
EO (device A) EO (device B) (devf:e C) c*> n: 4-bit 8-bit
.
parallel parallel
mode 20 mode 10
SHARP
LH1514AF
12
8. Precaution OPrecaution when connecting or disconnecting the power This LSI has a high-voltage LCD driver, so it may be permanently damaged by a high current which may flow if a voltage is supplied to the LC drive power supply while the logic system power supply is floating. The detail is as follows. *When connecting the power supply, connect the LC drive power after connecting the logic system power. Furthermore, when disconnecting the power, disconnect the logic system power after disconnecting the LC drive power. *We recommend you connecting the serial resistor (50 to 100 !I) to the LC power Vs of the system as a current limitter resistor. And set up drive the suitable value of the resistor in consideration of LC display grade. And when connecting the logic power supply, the logic condition of this LSI inside is insecurity. Therefore connecting the LC drive power supply after resetting logic condition of this LSI inside on DISPOFF function. After that, cancel the DISPOFF function after the LC drive power supply has become stable. Furthermore, when disconnecting the power, set the LC driver output pins to level V0 on DISPOFF function. After that, disconnect the logic system power after disconnecting the LC drive power. When connecting the power supply. show the following recommend sequence.
LH1514AF
13
9. Absolute
Maximum
Ratings
10. Recommended
Operating
Conditions
11. Electrical 11-1.
Characteristics
.
DC Characteristics
(Selection) Consumed current
(3)
Is
vDD=-5 v,*q vDo=-3 v.*4v5I. vL)o=-5 v,*4
,V5R
5.0 1.0 1.0
mA mA mA
[Note] *l : lAV,,~,j=0.5 V *2 : VL,O=-5.0 V, V5=-28.0 V. V,H=`?SS, VIL=VDD, TEST,=TEST2=VDD *3 : Vs.=-28.0 V, fxcK=6.15 MHz, No-load The input data is turned over by data taking clock(4-bit parallel *4 : V5=-28.0 V, fxcK=6.15 MHz, f ~~=19.2 kHz, fFR=80 Hz, No-load The input data is turned over by data taking clock(4-bit parallel
input input
mode) mode)
SHARP
LH1514AF
14
AC Characteristics (Vss=V,=O v. VIlrJ=- 5.5 to -2.5 V, V5=-28.0 to -10.0 V. Ta=-20 to +85 "c) I Parameter ISymbo l/ Conditionsj Min. 1 TYD. 1 Max. lunid -*. , ns Shift clock period 65 ns Shift clock "H" pulse width LwcKH 65 ns Shift clock =L" pulse width tWCKL ns tn. 50 __I Data setup time 40 ns Data hold time tDH 65 ns Latch pulse "H" pulse width tWLPH 0 ns Shift clock rise to Latch pulse rise time tLo llS 65 Shift clock fall to Latch pulse fall tim f tnL -65 ns Latch pulse rise to Shift clock ri se time tLS T.atrh nlrlse ---fall to Shift clock fa 11 time tLH 65 ns ----__ r----145 ns Enable setup time ts DT'D" .,,,,n "L" pulse width tWDL ii t rem JISPOFF removal time Input signal rise time tr Note Input signal fall time tr Output delay time (1) XCK to EIO,,EI02 to C:L=15 pF Outnut delay time (2) FR to Y,-Yao tpdt Cutput delay time (3) LP to Y1-Yso tpdz Output delay time (4) DISPOFF to Y,-Yso tpda 1.2 1 ps. )/2 is maximum in the cas e of high speed operation. [Note] (tCK-tWCKH-tWCKL
11-2.
11-3.
Timing Timing
Diagrams Characteristics
tWLPH
Input
k
I
>I
1
LP I
tLD < tLS < Y \ / ,, fSL \ / tWCKH
I
,tL \
XCK c ,I p < DIo-DI, tr twc K tr \/ \ t DS ,/ , , toil I
SHARP
LH1514AF
Input/Output
Timing
Characteristics
DISPOFF
Lp A-.
_... r\*
(*:>
.-... `jlT-\
EO
..._..
(*) n : d-bit &bit Timing Characteristics 1 parallel parallel mode 20 mode 10
Outnut LP
FR
-tpd2
-`tpdl L
-bd2
-tsdl
7
Y1-Ye0
VS VS
Output
Timing
Characteristics
2
DISPOFF
1
`
,
u I
LH1513Ax2 -r------+
SHL .YODE FR
COM,
CK-
`* (n-4)R<
::qgg---
r-H--+ `1 1 1 1 1 1 1 1
; : >
0
1 640x200DOT MATRIX LCDPANEL
b i3 u
VeEZ-----l (Case of l/n bias)
YD FB LP
2
om XCK
=: 0 =: 2
I
XDo-XD?
1 , ___ I I
LH1514AFx8
-
SHARP
LH1514AF
13. Example
of Typical
Characteristic Conditions "c, VSS=O V, `IDo=-5.0 Him. V TYP. 50 Max. Unit ns
Parameter Typical Fundamental Rating Propagation Delay Time
Ta=+25
.
SHARP
14. PACKAGE AND PACKING LH IS I-lAF SPECIFICATION 18 1 1. Package Outline Specification Refer to drawing No. SPN2 17 I-00 2. Markings The meanings of the device code printed (1) Date code (example)
on each tape carrier
package are as follows.
: --- i 7 0 -I a) b) c) a) denotes the last figure of Anno Domini (of production) b) denotes the week (of production) c) denotes the number of times of ;tlteration
3. Packing Specifications 1) Packing Materials Item Reel Separator Laminated Adhesive Carton Label Desiccant aluminium tape paper bag
Material Anti-static treated plastic (40Smm dia.) Anti-static treated PET (188 f( nit) (520 X 600mm)
Cardboard(420x420xSOmm) Papet Silica gel
Purpose Packing of tape carrier package. Protects device and prevents ESD (Electra Static Discharge) Keeping dry. Fixing of tape carrier package and soarator. Contains a reel. Indicates production name, lot.No.. and auantitv. Drying of device
(2) Packing Form + Specification of label a) Tape carrier package(TCP)is wound on a reel with separators I and 2 and the ends of them are fixed with adhesive tape. b) A label indicating production name. lot no. TYPE PRODUCTION NAME and quantity is stuck on one side of the reel. LOT NO. c) The reel and silica gel is put in a laminated aluminium bag. Nitrogen gas is enclosed in QUANTITY QUANTITY the bag and the bag is sealed. The same label(b) is affixed to the bag. The bag is put LGT(DATE) SHIPPING DATE in a carton and the same label(b) is affixed to one side of the carton. 4. Miscellaneous (1) The length of the tape carrier is 34 L 46 meters maximum per reel, and depends on shipping quantity. (2) Before unpacking, Also, the operater (3) The device, atomosphere ISSUE DATE prepare a work bench equipped with anti-static shoud ware anti-static wrist bands. devices. temperature '
once unpacked. should be stored in a nitrogen and used within I \\,eek. AUG.24.199-l H6805 APROVE CHECK DESIGN
gas, room (NOTE)
.
ISSUE NUMBER S/C NUMBER
LH1514AF NOTES:l.REEL
anti-static treated Plastic
19 WINDING
o*ttern surface
I
h -z c
23.05 22. 65(E. 20.OlCSR) 19.7
kO.05 L. 1 20.05
3
ZB
1
1
I'
0. 6 *o. 0
02 -`\\ `,d
0. 4 3.
g" .p
06 +' fl *a .
l *!J.lr*tor
0 11 I I' I' -_A' .
0.75MAX 2. RESIN AREA OF FRONT AND BACK SURFACE IS 18. 5X3. Smm(MAX). 3. E. L. MEANS ASSUMED EXCISING LINE. 4.SL MEANS DIMENSION OF PUNCHING HOLE AND ITS TOLERANCE IS fO.05mm. 5.SR MEANS DIMENSlON OF SOLDER RESIST AND ITS TOLERANCE IS fO.3mm.
OOMAX
TillI' ,'
,F
I=
-----.
I---
good
device
hole
19.7
kO.05
(PI)


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